By John Lau, Cheng Lee, C. Premachandran, Yu Aibin
A complete advisor to 3D MEMS packaging tools and recommendations Written by means of specialists within the box, complicated MEMS Packaging serves as a helpful reference for these confronted with the demanding situations created through the ever-increasing curiosity in MEMS units and packaging. This authoritative consultant provides state of the art MEMS (microelectromechanical structures) packaging options, comparable to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you choose trustworthy, inventive, high-performance, strong, and within your means packaging recommendations for MEMS units. The e-book also will reduction in stimulating additional study and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, techniques, production, trying out, and reliability. one of the themes explored: complex IC and MEMS packaging tendencies MEMS units, advertisement functions, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding concepts Actuation mechanisms and built-in micromachining Bubble swap, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging
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Additional resources for Advanced MEMS Packaging (Electronic Engineering)
76. “Microelectronic composite, especially packaging structure in sealing cavity of MEMS,” Robert, Philippe, JP2007245339 (A)—2007-09-27. 31 32 Chapter One 77. “Surface coating for electronic systems,” Cho, Junghyun (US), Oliver, Scott (US) (+2), US7282254 (B1)—2007-10-16. 78. “Self-packaging MEMS device,” Heck, John (US), US2007235501 (A1)—2007-10-11. 79. “Multi-unit planar lightwave circuit wavelength dispersive device,” Colbourne, Paul (CA), CA2584147 (A1)—2007-10-06. 80. “Packaging structure of MEMS microphone,” Park, Sung Ho (KR), Lim, Jun (KR) (+1), KR100737726 (B1)—2007-07-04.
29 30 Chapter One 44. “Microelectronic flow sensor packaging method and system,” Ricks, Lamar F. (US), WO2008057911 (A2)—2008-05-15. 45. “Hermetically sealed wafer level packaging for optical MEMS devices,” Yang, Xiao (US), GB2443352 (A)—2008-04-30. 46. “Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates,” Patel, Satayadev R. (US), Huibers, Andrew G. (US) (+8), US2008096313 (A1)—2008-04-24. 47. “Package structure and packaging method of MEMS microphone,” Chen, Jung-Tai (TW), Chu, Chun-Hsun (TW), US2008083960 (A1)—2008-04-10.
MEMS switch and method for packaging the same,” Lee, Dae Sung (KR), Sung, Woo Kyung (KR) (+3), KR20050113340 (A)—2005-12-02. Introduction to MEMS 123. “Method of packaging of MEMS device at the vacuum state and vacuum packaged MEMS device using the same,” Lee, Ho Young (KR), Kim, Yong Hyup (KR) (+3), KR20050100039 (A)—2005-10-18. 124. “Electronic parts packaging structure and method of manufacturing the same,” Sunohara, Masahiro (JP), Higashi, Mitsutoshi (JP), US2006246630 (A1)—2006-11-02. 125.
Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin